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Popularization of knowledge about processors: what are LGA, PGA, BGA packages? Comparison of three packaging methods
What are LGA, PGA, BGA packages? As we all know, there are three main types of CPU packages: LGA, PGA, and BGA. Among them, LGA package is most common, and all Intel processors use this package type, while PGA package is widely used package type. from AMD. Today's installation at home will help you popularize knowledge of CPU packaging, as well as compare LGA, PGA and BGA packaging methods, I hope you enjoy it.
What is a CPU package?
The physical structure of a CPU consists of wafers and circuit boards, as well as other capacitors and other elements.
As to why plate is round, it is mainly due to consideration of technique, convenient cutting, and use at a later stage. Then cut out square is plate on processor.
▲The physical composition of processor. Then CPU plate is cut off, connected to PCB, and then with or without a protective cover, this is finished CPU.
But! The processor can no longer work, it needs to be connected to motherboard, so way to connect to motherboard is called encapsulation. (It's a little shallow, but I think you can understand)
There are three types of packaging: LGA, PGA, BGA.
The full name of LGA is "ground grid array" or "flat grid array package".
▲Our mainstream Intel processors mostly use this packaging method.
All Intel desktop processors since 775
AMD Opteron, Snapdragon, TR and other processors
The characteristic of this packaging method is that all pins are on CPU PCB, and back of entire CPU is covered by back of CPU in a grid pattern. Make contacts work. . So you will see that while this is a processor in an LGA package, the pins must be on motherboard and LGA package is relatively fragile due to pin design problems and motherboard pins are damaged, this most likely means that the entire motherboard is damaged.
▲ Repair of LGA contacts is not only a technical problem, but also a visual problem.
The PGA's full name is "pin grid array" or "pin grid array package".
▲AMD mainstream CPUs and old Core Mobile MQ series mainly use PGA packaging method.
Most desktop processors up to Intel 775
Nearly all AMD home desktop processors
Intel mostly mobile processors ending with M, MQ
Unlike LGA, PGA concentrates pins on PCB of CPU, so you'll see pin group on CPU, and motherboard only needs to provide a socket to insert pins. Because it needs to be moved many times, PGA contacts are stronger than LGA. Even if there is a bend, it can be restored with a relatively simple method. We can say that PGA is much better than LGA in terms of protection.
The full name of BGA is "ball array array" or "ball array kit".
▲Currently, most mobile Intel processors use this packaging method.
All Intel products end with H, HQ, U, Y, etc., including but not limited to low voltage processors.
AMD low-voltage mobile processors.
All phone processors.
BGA may be an extreme product of LGA and PGA, which differs from their characteristics in that they can be replaced at will. Once BGA is packaged, ordinary players cannot take it apart and replace it in usual way, unless no professional hardware is used.But because it's done in one go, BGA can be made shorter and smaller.
Comparison of three packaging methods:
Strictly speaking, everyone has their winners and losers, and there is no better one.
LGA: Compared to PGA, it is smaller and replaceable than BGA. However, requirements for operational errors during replacement process are more stringent.
PGA: The volume is largest among three packages, but it is easy to replace and error requirements of replace operation are low.
BGA: The volume is smallest among three packages, but replacement is close to 0. At same time, due to problems with packaging process, if BGA pins are not aligned or aligned during packaging process, this most likely means recycling, so compared to LGA, PGA yield is lower.
There is no doubt that LGA and PGA are main directions of development for us DIY enthusiasts. But with development of processors, especially in mobile field. However, with evolution of mobile processors, Intel is phasing out mobile processors in PGA packages after fourth generation and switching to BGA packages. Such a move will certainly disappoint future DIY notebook manufacturers. And processor in BGA package will most likely be scrapped along with motherboard, which is just a waste of money for garbage collectors who love to collect garbage.
But speaking of packaging methods, these three packaging methods are simply way processor and motherboard interact. It's also because it's only one way, which means BGA processor turns original BGA processor into a PGA via a simple PGA PCB.
The arrival of this step certainly means that BGA processors can shine again. Already in second and third generation of Core processors, there were processors that could be packaged from BGA to PGA via PCB. It can be said that these processors have greatly enriched homemade processor market.
But it's also risky because as mentioned above, BGA packaging can have quality issues, Intel's own machines can have issues, not to mention Xbao production?