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A simple and clear way to help you understand SLC, MLC solid state hard drives, TLC particle knowledge
I believe that many users know more about interface and capacity of SSDs, but know nothing about SLC, MLC and TLC particle types, 64C NAND and 3D NAND processes. Today I try to popularize science for everyone in an understandable form.
SSDs use flash memory chips to store data. The smallest unit of data storage is called a cell. Each cell stores 1 data bit, which is called SLC, and stores 2 data bits, which is called MLC, stores 3 data bits, which is called TLC, stores 4 Data bits, which is QLC and so on.
To make it easier to understand, let's take a less strict analogy, compare a chip to a sheet of paper filled with grids, compare a cell to grids on paper, compare data to sesame seeds, on Paper Put one sesame in each grid - SLC, put two sesame seeds - MLC, put three sesame seeds - TLC. At this time, we found that on same sheet of paper, SLC can store smallest amount of sesame seeds (smallest storage space), MLC is twice as much, and TLC is three times! You know, this "paper" (chip wafer) is very expensive.The same wafer only weighs 128 GB when converted to SLC, 256 GB when converted to MLC, and 512 GB when converted to TLC, and cost is basically same , this is reason why big manufacturers are struggling to get into TLC and QLC. After all, bigger capacity, more money they can sell, which is why The market is now almost dominated by TLC< /strong> SSDs, that's why.
As for 3D NAND, it refers to traditional 2D NAND process. Borrowing paper analogy above, there is only one sheet of paper in each chip of traditional process, so sesame seeds that can be loaded are limited; I can put a few more sheets of paper, it would be great if they were folded together, could you put a lot of sesame seeds in each of them? That's how 3D NAND was born, and Samsung, Intel, Micron, and Toshiba started to sharpen their heads by packing more paper into their chips than anyone else. Your family stacked 16 sheets, and my family stacked them 32 sheets (32 layers), I stacked 48 sheets (48 layers) at first glance, and gradually everyone mastered technology of stacking 64 sheets (64 layers), and began mass production and output to market.
So we've seen 3D NAND products on market like Intel 760P and Samsung 860EVO. Their common feature is that capacity of a single chip can be increased, and unit price per GB can be lower than Previously, performance of previous main control circuit can also be higher than before, so solid state hard drives SSD will move step by step in direction of popularization, manufacturers and consumers will benefit from this.